Socket for electrical component

ABSTRACT

An IC socket ( 11 ) comprises contact pins ( 14 ) disposed in the socket body ( 13 ) to be disjunctive to terminals of the IC package ( 12 ), an opening and closing body ( 19 A, 19 B) rotatably provided in the socket body ( 13 ), the opening and closing body ( 19 A, 19 B) having a pressing member ( 23   a,   23   b ) for pressing a top surface of the IC package ( 12 ) accommodated on an accommodating surface portion ( 16   d ) of the socket body ( 13 ); and an operating member ( 20 ) for opening and closing the opening and closing body ( 19 A, 19 B) disposed up and down movably with respect to the socket body ( 13 ). A first opening and closing body ( 19 A) having a heat sink ( 23   a ) for pressing an entire of the top surface of the IC package ( 12 ) and a second opening and closing body ( 19 B) having a block ( 23   b ) for pressing the heat sink ( 23   a ) are disposed at different positions mutually.

TECHNICAL FIELD

This invention relates to a socket for electrical component thatremovably accommodates an electrical component, such as a semiconductordevice (hereinafter referred to as an “IC package”).

BACKGROUND ART

Conventionally, this type of “socket for electrical component” is knownas an IC socket which removably accommodates an IC package which is an“electrical component”.

The IC socket is provided with contact pins in contact with theterminals of the IC package in the socket body, and an opening andclosing body is rotatably disposed in the socket body so that the ICpackage accommodated in the socket body is pressed when the opening andclosing body is closed.

The opening and closing body is biased in the closing direction (thedirection of pressing the IC package) and is configured to be openedagainst the biasing force to accommodate and take out the IC package bylowering an operating member which is up and down movably disposed inthe socket body.

Then, by pressing the IC package with the opening and closing body, theterminals of the IC package and the contact pins are contacted at apredetermined pressure.

In addition, a heat sink is provided in the opening and closing body,and the heat sink is contacted with the IC package so that heat of theIC package is dissipated.

In an open-top type socket for electrical component, when the openingand closing body of an integral and cantilever type rotatably disposedin the socket body performs an opening and closing motion and is openedand rises up, its height is required above the upper portion of thesocket body, so that the open-top type socket for electrical componentis difficult to use in an automatic machine.

Accordingly, a number of IC sockets are used in which the opening andclosing body is divided into two or four sections, for example, so thatwhen each section of the opening and closing body is opened, the heightto rise on the socket body is reduced and the operating space on thesocket body is reduced (see, e.g., Patent Document 1 below).

PRIOR ART DOCUMENT Patent Document

Patent Document 1: Japanese Patent Application Publication No.2003-303658

SUMMARY OF INVENTION Problems to be Solved by the Invention

However, in a socket for electrical component in which the opening andclosing body that presses the electrical component is divided into aplurality of sections, when the opening and closing body is rotated onthe socket body to operate the opening and closing motion, it wasnecessary to provide clearance between the tips of the opening andclosing bodies because the tips of the opening and closing bodiesopposite each other interfere with each other.

Accordingly, in the vicinity of the tips of the plurality of the openingand closing bodies, the pressing force on the electrical componenttended to be insufficient.

Furthermore, when the heat sink is installed in the opening and closingbody, the heat transfer speed decreases or the heat transfer areadecreases due to insufficient pressure contact at the positioncorresponding to the clearance or in the vicinity thereof. Therefore,the heat dissipation effect easily varies.

In particular, as in the case of small IC packages, which have beenfrequently used in recent years, the clearance between the plurality ofthe opening and closing bodies tends to cause large variations in thepressing force and heat dissipation effects.

Accordingly, the present invention aims to provide a socket forelectrical component which can be pressed uniformly by sufficientpressing force on an entire of the top surface of the electricalcomponent regardless of the position or shape of the electricalcomponent, while using the plurality of the opening and closing bodiesto minimize the operating space above the socket body.

Means for Solving Problems

A socket for electrical component comprising: a socket bodyaccommodating an electric component; contact pins disposed in the socketbody to be disjunctive to terminals of the electrical component; anopening and closing body rotatably provided in the socket body, theopening and closing body having a pressing member for pressing a topsurface of the electrical component accommodated on an accommodatingsurface portion of the socket body; and an operating member for openingand closing the opening and closing body disposed up and down movablywith respect to the socket body;

wherein the opening and closing body includes a first opening andclosing body having a first pressing member for pressing an entire ofthe top surface of the electrical component and a second opening andclosing body having a second pressing member for pressing the firstpressing member, the first opening and closing body and the secondopening and closing body are disposed at different positions mutually.

In the socket for electrical component of the present invention, aclosing timing of the first opening and closing body and the closingtiming of the second opening and closing body may be different so thatthe second opening and closing body closes after the first opening andclosing body closes.

In the socket for electrical component of the present invention, thefirst pressing member may be a heat sink.

Further, in the socket for electrical component of the presentinvention, the first opening and closing body and the second opening andclosing body may be openably and closably disposed opposite each other,the first pressing member may be provided with a protruding portionprotruded toward to a side of the second pressing member, the secondpressing member may be provided with a concave portion for accommodatingthe protruding portion, and the protruding portion may be provided witha part portion of a pressing surface for pressing the electricalcomponent.

Effect of Invention

According to the socket for electric component of the present invention,since the opening and closing body having a pressing member for pressinga top surface of the electrical component accommodated on anaccommodating surface portion is divided into a plurality of sections,the elevation height of the opening and closing body relative to thesocket body can be kept low, and the operating space above the socketbody can be reduced.

Since the first pressing member for pressing an entire of the topsurface of the electrical component provided of the first opening andclosing body is pressed by other pressing member of the other openingand closing body, the entire of the top surface of the electricalcomponent can be pressed by not only the pressing force obtained by thefirst opening and closing body but also by the pressing force obtainedby the plurality of opening and closing bodies, even if the opening andclosing body is divided into a plurality of sections. Therefore, theentire of the top surface of the electrical component can be presseduniformly with sufficient pressing force, regardless of the position orshape of the electrical component.

Accordingly, a socket for electrical component can be provided in whichthe entire of the top surface of the electrical component can be presseduniformly with sufficient pressing force, regardless of the position orshape of the electrical component, while the operating space above thesocket body can be kept small.

In the socket for electrical component of the present invention, if aclosing timing of the first opening and closing body and the closingtiming of the second opening and closing body are different so that thesecond opening and closing body closes after the first opening andclosing body closes, the first opening and closing body and the secondopening and closing body can realize reliable operation withoutinterference during their rotation even if the rotation regions arepartially overlapped because the second pressing member of the secondopening and closing body presses the first pressing member of the firstopening and closing body.

In the socket for electrical component of the present invention, if thefirst pressing member is a heat sink, the heat sink can contact to theentire of the top surface of the electrical component uniformly with asufficient pressing force as much as possible, regardless of theposition or shape of the electrical component, and the heat transferspeed and heat transfer area can be secured by efficiently dissipatingheat.

In the socket for electric component of the present invention, if thefirst opening and closing body and the second opening and closing bodyare openably and closably disposed opposite each other, if the firstpressing member is provided with a protruding portion and the secondpressing member is provided with a recess portion for accommodating theprotruding portion, and if the protruding portion is provided with apart portion of a pressing surface for pressing the electricalcomponent, the pressing force of the first pressing member and thepressing force of the second pressing member can be loaded moreuniformly even if the electrical component is small, and it is reliablyavoided that the clearance inevitably formed between the first openingand closing body and the second opening and closing body is placed onthe top surface of the electrical component.

BRIEF EXPLANATION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an IC socket according to anembodiment of the present invention showing a pair of the opening andclosing bodies being closed.

FIG. 2 is a perspective view illustrating the IC socket according to theembodiment of the present invention showing a pair of the opening andclosing bodies being opened.

FIG. 3 is a perspective view illustrating the first opening and closingbody of the IC socket according to the embodiment of the presentinvention.

FIG. 4 is a plan view illustrating the IC socket according to theembodiment of the present invention showing the first and second openingand closing body being closed.

FIG. 5 illustrates the IC socket according to the embodiment of thepresent invention showing the first and second opening and closingbodies being closed, wherein (a) is a side view and (b) is an I-Icross-sectional view of FIG. 1.

FIG. 6 is a side view illustrating the IC socket according to theembodiment of the present invention showing the first and second openingand closing bodies being fully opened.

FIG. 7 illustrates the IC socket according to the embodiment of thepresent invention showing a middle state toward closing from an openedstate of the first and second opening and closing bodies, wherein (a) isa side view and (b) is an I-I cross-sectional view of FIG. 1.

FIG. 8 is a perspective view illustrating an IC socket according to amodification of the embodiment of the present invention, showing a pairof the first and second opening and closing bodies being opened.

EMBODIMENT FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the Present invention will be described indetail with reference to figures.

As shown in FIGS. 1 to 5, the numeral 11 is an IC socket as a “socketfor electrical component”, and the IC socket 11 is used to electricallyconnect a plate-like terminal of the IC package 12 to a printed wiringboard (not shown) of a measuring instrument (tester) for performingperformance tests of the IC package 12 as an “electrical component”.

The IC package 12 is a so-called LGA (Land Grid Array), and theterminals are arranged in a matrix on the underside surface of thesquare package body.

The IC socket 11 has a socket body 13 disposed on a printed wiringboard. The socket body 13 includes a base portion 15 in which a numberof contact pins 14 are disposed to contact the terminals of the ICpackage 12, and a floating plate 16 disposed above the base portion 15.

A pair of opening and closing bodies 19A, 19B for pressing the uppersurface of the IC package 12 are rotatably mounted on the socket body13, and an operating member 20 of square frame-shape for opening andclosing the opening and closing bodies 19A, 19B is up and down movablyarranged on the socket body 13.

The contact pins 14 of the present embodiment are formed of a springyand electrically conductive plate and is press-fitting fixed to theholes of the base portion 15. Leads protruding downwardly from the baseportion 15 are electrically connected to the printed wiring board.

A contact portion is formed at the upper end portion of each of thecontact pins 14, which is inserted through a through hole in thefloating plate 16 in an elastically biased manner, and is electricallyconnected to the terminals of the IC package 12 from below.

The floating plate 16 is provided with a square-shaped accommodatingsurface portion 16 d for the IC package 12 so as to be able toaccommodate the IC package 12 on the accommodating surface portion 16 d.

In the present embodiment, the accommodating surface portion 16 d issurrounded by a plurality of guide pins 16 b in the central portion ofthe floating plate 16. The upper end portion of each of the guide pins16 b has a tapered shape, and the IC package 12 is precisely positionedand accommodated in the accommodating surface portion 16 d by beinginserted along the plurality of guide pins.

The floating plate 16 is up and down movably disposed with respect tothe base portion 15 and is biased upwardly by a spring 17. The stopperportion 15 b extending from the base portion 15 is configured to beguided and stopped at the top dead point position.

As shown in FIGS. 3 and 4, the first opening and closing body 19A andthe second opening and closing body 19B are rotatably disposed in thesocket body 13 at different positions through the opening and closingmechanism. Here, it is possible to open and close in the oppositedirection, so-called double doors is possible.

In this embodiment, the size of the first opening and closing body 19Aand the second opening and closing body 19B in planar view issubstantially equal.

The first opening and closing body 19A includes a base plate 22 and aheat sink 23 a as “first pressing member” attached to the base plate 22.

The second opening and closing body 19B includes a base plate 22likewise the case of the first opening and closing body 19A and a block23 b as “second pressing member” attached to the underside surface ofthe base plate 22.

The base plate 22 is formed to be substantially equal size in plan viewin the first opening and closing body 19A and the second opening andclosing body 19B, and the base plate 22 includes a plane portion 22 ahaving a concaved shape portion concaved from the tip end side in planview and a vertical piece portion 22 b bent to both ends of the planeportion 22 a in the width direction to which the opening and closingmechanism is connected.

The heat sink 23 a includes a support portion 23 c disposed above theplane portion 22 a of the base plate 22 when the first opening andclosing body 19A is closed, and a convex portion 23 d integrally formedwith the support portion 23 c and protruding below the plane portion 22a near the center of the floating plate 16 when the first opening andclosing body 19A is closed.

The support portion 23 c of the heat sink 23 a is disposed on the topsurface of the plane portion 22 a of the base plate 22 and is guided bya mounting screw 29 threaded to the plane portion 22 a to bedisplaceable in a vertical direction with respect to the plane portion22 a. The support portion 23 c is biased by a coil spring 30 in adirection in which the support portion 23 c is abutted against the planeportion 22 a.

The support portion 23 c is provided with a heat dissipation fin 23 ewhich is protruded and has a suitable shape for efficiently performingheat dissipation.

The convex portion 23 d of the heat sink 23 a is provided with apressing surface 23 f that presses an entire of the top surface of theIC package 12 at a position facing the accommodating surface portion 16d when the first opening and closing body 19A is closed, and a pressedand locked portion 23 g locked and pressed downward by the block 23 b ofthe second opening and closing body 19B.

The block 23 b of the second opening and closing body 19B is fixed tothe plane portion 22 a of the base plate 22 and is configured to enableto press the heat sink 23 a downwardly. The block 23 b of the secondopening and closing body 19B is provided with a pressing locking portion23 h which is in contact with the pressed and locked portion 23 g of theheat sink 23 a and is capable of pressing downwardly.

Not particularly limited, a protruding portion 23 j is formed protrudedtoward the side of the second opening and closing body 19B at the distalend of the heat sink 23 a of the first opening and closing body 19A, anda concave portion 23 i is formed in the block 23 b of the second openingand closing body 19B concaved from the side of the distal end. When thefirst opening and closing body 19A and the second opening and closingbody 19B are closed, the protruding portions 23 j is accommodated in theconcave portion 23 i. The protruding portion 23 j is provided with apart of the convex portion 23 d of the heat sink 23 and a part portionof the pressing surface 23 f at the lower end of the convex portion 23d.

In this embodiment, the protruding portion 23 j of the heat sink 23 a isaccommodated in the concave portion 23 i of the block 23 b, so that theconvex portion 23 d of the heat sink 23 a is disposed near the center ofthe floating plate 16, and the pressing surface 23 f provided in theconvex portion 23 d is disposed at a position facing the accommodatingsurface portion 16 d of the floating plate 16.

Further, the pressing locking portion 23 h of the heat sink 23 a isprotruded into the concave portion 23 i of the block 23 b, and when thesecond opening and closing body 19B is closed, the block 23 b of thesecond opening and closing body 19B contacts and presses downward thepressed and locked portion 23 g of the convex portion 23 d of the heatsink 23 a.

Such heat sink 23 a may be formed of a material such as a metal havinggood thermal conductivity, such as, for example, aluminum die casting.The block 23 b may also be made of a metal having good thermalconductivity, such as aluminum die casting, as well as the heat sink 23a.

The opening and closing mechanism of the first opening and closing body19A and the second opening and closing body 19B connects the firstopening and closing body 19A and the second opening and closing body 19Bto the socket body 13 so that the first opening and closing body 19A andthe second opening and closing body 19B are rotatable to be opened andclosed, and in this embodiment a link mechanism 27 is provided.

The link mechanism 27 includes a first link member 24 and a second linkmember 26 each of which is provided as a pair on each side of the baseplate 22, and connects a support post 15 c of the base portion 15 of thesocket body 13, the vertical piece portions 22 b of the base plate 22 ofthe first opening and closing body 19A and the second opening andclosing body 19B, and the operating member 20.

The configuration of the link mechanism 27 is not particularly limited.The link mechanism 27 may be anything so long as the link mechanism 27can make the first opening and closing body 19A and the second openingand closing body 19B open and close by raising and lowering theoperating member 20 relative to the socket body 13 so that the ICpackage 12 can be taken in and out above the accommodating surfaceportion 16 d of the floating plate 16 and also the heat sink 23 a candisplace from a pressing position for pressing the IC package 12 to astandby position by the link mechanism 27.

In this embodiment, for example, the first link member 24 is rotatablyconnected to the support post 15 c of the base portion 15 of the socketbody 13 at one end and is rotatably connected to the vertical pieceportion 22 b of the base plate 22 of the first opening and closing body19A and the second opening and closing body 19B at the other end, andthe second link member 26 is rotatably connected to the operating member20 at one end and rotatably connected to the vertical piece portion 22 bof the base plate 22 of the first opening and closing body 19A and thesecond opening and closing body 19B at the other end.

The operating member 20 exhibits a square-shaped frame with an opening20 a of a size in which the IC package 12 can be inserted and is up anddown movably arranged relative to the socket body 13. The operatingmember 20 is biased upward.

The upper surface of the four corners of the operating member 20 is anoperation input portion 20 b for pressing the operating member 20 fromabove and lowering the operating member 20.

For example, the operation input portion 20 b is pressed downward by apresser (not shown), so that the operating member 20 can be loweredagainst the biasing force of the operating member 20, and the firstopening and closing body 19A and the second opening and closing body 19Bcan be opened and closed through the link mechanism 27. Here, theopening and closing amount of the first opening and closing body 19A andthe second opening and closing body 19B can be realized according to thedisplacement amount of the operating member 20.

The operation input portion 20 b of the operating member 20 is providedwith a timing adjustment means for differentiating the closing timingbetween the first opening and closing body 19A and the second openingand closing body 19B so that the second opening and closing body 19B isclosed after the first opening and closing body 19A is closed. In thisembodiment, as the timing adjustment means, a spacer 20 c is disposed onthe upper surface of the two operation input portions 20 b disposed onthe second opening and closing body 19B side.

If the spacer 20 c is provided on the second opening and closing body19B side, the operating member 20 on the side of the second opening andclosing body 19B can be pressed ahead of the first opening and closingbody 19A by the thickness of the spacer 20 c when the operation inputportion 20 b in the four corners of the operating member 20 is pressedby a presser or the like of an automatic machine disposed at the sameheight, and the second opening and closing body 19B can be opened beforethe first opening and closing body 19A is opened, and the second openingand closing body 19B can be closed after the first opening and closingbody 19A is closed.

The IC package 12 can be accommodated in the IC socket 11 as follows.

First, for example, the operation input portion 20 b in the four cornersof the operating member 20 is pressed by a presser (not shown) of theautomatic machine. As shown in FIG. 6, the operating member 20 is pusheddown against the biasing force and displaced to the lowest end position.

As shown in FIG. 2, the first opening and closing body 19A and thesecond opening and closing body 19B can be opened against the biasingforce and are opened to the maximum extent. The first opening andclosing body 19A and the second opening and closing body 19B aredisposed in a substantially vertical direction and retreated from therange of the accommodating surface portion 16 d for accommodating the ICpackage 12.

In this state, the IC package 12 is guided by guide pins 16 b on thefloating plate 16 and accurately accommodated on the accommodatingsurface portion 16 d.

Thereafter, by raising the presser (not shown) of the automatic machine,the operating member 20 is restored to an upward position by the biasingforce, and the first opening and closing body 19A and the second openingand closing body 19B are moved in the closing direction by the biasingforce.

At this time, the amount of closing of the first opening and closingbody 19A and the second opening and closing body 19B corresponds to therising amount of the operating member 20 connected through the linkmechanism 27.

Since a spacer 20 c is disposed in the operation input portion 20 b ofthe second opening and closing body 19B of the operating member 20, theamount of closing of the first opening and closing body 19A increasesahead of that of the second opening and closing body 19B as shown inFIG. 7(a) (b). Accordingly, the pressed and locked portion 23 g of theheat sink 23 a of the first and closing body 19A is disposed below thepressing locking portion 23 h of the block 23 b of the second openingand closing body 19B.

Thereafter, when the operating member 20 is opened by raising thepresser (not shown) of the automatic machine, the operation inputportion 20 b at the four corners of the operating member 20 rises to thesame height as shown in FIG. 5(a) (b), and the first opening and closingbody 19A and the second opening and closing body 19B are completelyclosed.

Accordingly, the IC package 12 can be pressed to the accommodatingsurface portion 16 d by the pressing surface 23 f while the heat sink 23is pressed by the block 23 b of the second opening and closing body 19B.

In this case, since the heat sink 23 a is disposed in a verticallymovable manner with relative to the base plate 22 and the supportportion 23 c is biased against the plane portion 22 a of the base plate22, a fine angular adjustment can be made when the package body of theIC package 12 is pressed on the pressing surface 23 f of the heat sink23 a, so that the pressing surface 23 f of the convex portion 23 d canhave a reliable correspondence with the surface of the IC package 12 andcan be pressed in a balanced manner.

According to the IC socket 11 described above, a plurality of openingand closing bodies having a pressing member for pressing the top surfaceof the IC package 12 on the accommodating surface portion 16 d of thesocket body 13 are provided, so that the elevation height of each of theopening and closing bodies 19A and 19B relative to the socket body 13can be kept low, and the operating space above the socket body 13 can bereduced.

Since the heat sink 23 a of the first opening and closing body 19A thatpresses the entire of the top surface of the IC package 12 is pressed bythe block 23 b of the second opening and closing body 19B, even if theopening and closing bodies 19A and 19B are divided into the plurality ofsections, the entire of the top surface of the IC package 12 can bepressed not only by the pressing force obtained by the first opening andclosing body 19A but also by the pressing force obtained by theplurality of opening and closing bodies 19A and 19B. Therefore,regardless of the position or shape of the IC package 12, the entire ofthe top surface of the IC package 12 can be pressed with sufficientpressing force as uniformly as possible.

Accordingly, in the IC socket 11 of this embodiment, the entire of thetop surface of the IC package 12 can be uniformly pressed withsufficient pressing force, regardless of the position or shape of the ICpackage 12, while the operating space above the socket body 13 can bekept small.

In the IC socket 11 of this embodiment, a closing timing of the firstopening and closing body 19A and the closing timing of the secondopening and closing body 19B are different so that the second openingand closing body 19B is closed after the first opening and closing body19A is closed. Therefore, the first opening and closing body 19A and thesecond opening and closing body 19B can realize reliable operationwithout interference during their rotation even if the rotation regionsare partially overlapped because the second pressing member of thesecond opening and closing body 19B presses the first pressing member ofthe first opening and closing body 19A.

Furthermore, in the IC socket 11 of this embodiment, since the heat sink23 a is mounted as the first pressing member, the heat sink 23 a can becontacted with the entire of the top surface of the IC package 12 asuniformly as possible with sufficient pressing force, regardless of theposition or shape of the IC package 12, and the heat transfer speed andheat transfer area can be secured by efficiently dissipating heat.

In the IC socket 11 of this embodiment, the heat sink 23 a of the firstopening and closing body 19A is provided with the protruding portion 23j and the part portion of the protruding portion 23 j is protrudedtoward to the side of the second opening and closing body 19B, and thesecond opening and closing body 19B is provided with the concave portion23 j for accommodating the part portion of the protruding portion 23 jand the part portion of the pressing surface 23 f of the protrudingportion 23 j is accommodated in the concave portion 23 j.

Accordingly, even if a small IC package 12 is used, it is possible touniformly load the pressing force by the heat sink 23 a and the pressingforce by the block 23 b, and it is reliably avoided that the clearanceinevitably formed between the first opening and closing body 19A and thesecond opening and closing body 19B is placed on the top surface of theIC package 12.

It should be noted that the above-described embodiment may be modifiedadequately within the scope of the present invention.

For example, in the above-described embodiment, the present invention isapplied to the IC socket 11 as a “socket for electrical component”, butit is of course applicable to other devices as well. In addition, in theabove-described embodiment, the present invention is applied to an ICsocket accommodating an LGA type as an “electrical component”, but ifthe electrical component is pressed by an opening and closing body, thepresent invention can be applied to an IC socket accommodating an ICpackage such as a BGA (Ball Grid Array) or PGA (Pin Grid Array).

In the above-described embodiment, the first and second opening andclosing bodies 19A and 19B are provided as opening and closing bodiesmounted to the socket body. However, the number of opening and closingbodies is not particularly limited and may be three or more opening andclosing bodies. Even in that case, the first opening and closing bodymay be better to be pressed by other plurality of opening and closingbodies.

In the above-described embodiment, the spacer 20 c, as a timingadjustment means for adjusting the closing timing of the first openingand closing body 19A and the second opening and closing body 19B so thatthe second opening and closing body 19B is closed after the firstopening and closing body 19A is closed, is disposed on the upper surfaceof the operation input portion 20 b on the side of the second openingand closing body, but the timing adjustment means is not particularlylimited. For example, the operation input portion 20 b of the flatoperating member 20 may be pressed with a pusher having different amountof projections from each other. Further, means for differentiating theclosing timing having various configurations may be provided at variouspositions of the first and opening and closing bodies.

Modification

FIG. 8 is a perspective view illustrating the IC socket 11 of amodification.

This embodiment is all the same as the first embodiment except that theshape of the heat sink 23 a of the first opening and closing body 19Aand the block 23 b of the second opening and closing body 19B.

In the heat sink 23 a of this modification, the convex portion 23 d isformed in a straight shape corresponding to the pressing surface 23 f.

Further, in the block 23 b of the second opening and closing body 19B,the concave portion 23 i is formed in the size to accommodate thestraight-shaped convex portion 23 d, and accommodating holes of guidepins 16 b around the accommodating surface portion 16 d are provided inthe floating plate 16.

Furthermore, the pressing locking portion 23 h is not provided in theconvex portion 23 d of the heat sink 23 a and the concave portion 23 iof the block 23 b, and the pressing locking portion 23 h and the pressedand locked portion 23 g are provided in other portion other than thepressing locking portion 23 h and the pressed and locked portion 23 g ofthe heat sink 23 a and the block 23 b.

Otherwise, the configuration is the same as that of the above-describedembodiment. Even the IC socket 11 of such a modification may have thesame effect as the above-described embodiment.

EXPLANATION OF REFERENCE

-   11 IC socket (socket for electrical component)-   12 IC package (electrical component)-   13 socket body-   14 contact pin-   15 base portion-   15 b stopper portion-   15 c support post-   16 floating plate-   16 b guide pin-   16 d accommodating surface portion-   17 spring-   19A first opening and closing body-   19B second opening and closing body-   20 operating member-   20 a opening-   20 b operation input portion-   20 c spacer-   22 base plate-   22 a plane portion-   22 b vertical piece portion-   23 a heat sink (the first pressing member)-   23 b block (second pressing member)-   23 c support portion-   23 d convex portion-   23 f pressing surface-   23 g pressed and locked portion-   23 h pressing locking portion-   23 i concave portion-   24 first link member-   26 second link member-   26 a side plate portion-   26 b connecting bridge portion-   27 link mechanism

1. A socket for electrical component comprising: a socket bodyaccommodating an electric component; contact pins disposed in the socketbody to be disjunctive to terminals of the electrical component; anopening and closing body rotatably provided in the socket body, theopening and closing body having a pressing member for pressing a topsurface of the electrical component accommodated on an accommodatingsurface portion of the socket body; and an operating member for openingand closing the opening and closing body disposed up and down movablywith respect to the socket body, wherein the opening and closing bodyincludes a first opening and closing body having a first pressing memberfor pressing an entire of the top surface of the electrical component,and a second opening and closing body having a second pressing memberfor pressing the first pressing member, the first opening and closingbody and the second opening and closing body are being disposed atdifferent positions mutually.
 2. The socket for electrical componentaccording to claim 1, wherein a closing timing of the first opening andclosing body and the closing timing of the second opening and closingbody are different so that the second opening and closing body closesafter the first opening and closing body closes.
 3. The socket forelectrical component according to claim 1, wherein the first pressingmember is a heat sink.
 4. The socket for electrical component accordingto claim 1, wherein the first opening and closing body and the secondopening and closing body are openably and closably disposed oppositeeach other, the first pressing member is provided with a protrudingportion protruded toward to a side of the second pressing member, thesecond pressing member is provided with a concave portion foraccommodating the protruding portion, and the protruding portion isprovided with a part portion of a pressing surface for pressing theelectrical component.
 5. The socket for electrical component accordingto claim 2, wherein the first pressing member is a heat sink.
 6. Thesocket for electrical component according to claim 2, wherein the firstopening and closing body and the second opening and closing body areopenably and closably disposed opposite each other, the first pressingmember is provided with a protruding portion protruded toward to a sideof the second pressing member, the second pressing member is providedwith a concave portion for accommodating the protruding portion, and theprotruding portion is provided with a part portion of a pressing surfacefor pressing the electrical component.
 7. The socket for electricalcomponent according to claim 3, wherein the first opening and closingbody and the second opening and closing body are openably and closablydisposed opposite each other, the first pressing member is provided witha protruding portion protruded toward to a side of the second pressingmember, the second pressing member is provided with a concave portionfor accommodating the protruding portion, and the protruding portion isprovided with a part portion of a pressing surface for pressing theelectrical component.